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Preparativa del mese Come ottenere i migliori risultati

A partire da Gennaio e per ogni mese del 2025, potrete sfruttare gli interessanti approfondimenti sul mondo della metallografia offerti gratuitamente da Qatm! Scoprite di più sulla Preparativa Metallografica e ottenete suggerimenti e trucchi interessanti dai nostri esperti. Le nostre "Preparative Metallografiche del Mese" vi attendono!

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Marzo Examination of the solder balls in the ball grid array (BGA)

In a BGA (Ball Grid Array) printed circuit board, the solder balls are crucial for the electrical and mechanical connection between the BGA casing and the circuit board. The material of the solder balls is typically a lead-free alloy, as lead-containing solders are increasingly being avoided due to environmental and health regulations.

The most common lead-free alloy is SAC305. Such tin alloys offer a balance between melting point, mechanical strength and electrical conductivity. As an example, the melting point of SAC305 is around 217-221 °C, which is slightly higher compared to lead-containing solders.

The metallographic examination of a solder joint on a printed circuit board is a common examination as part of the quality assurance of printed circuit boards. This month's preparation shows you how this tin solder can be optimally prepared for microscopic examination.

Preparative Metallografiche precedenti e future

Gennaio 2025 Additive manufactured Ti64 sample

The Ti-6Al-4V (Ti64) alloy, also known as Titanium Grade 5, is one of the most used titanium alloys in additive manufacturing. It combines different properties like strength, lightness and corrosion resistance, making it attractive to a wide range of industries, including aerospace, automotive and medical. A major advantage of Ti64 additive manufacturing is its ability to produce customized implants for medical applications. Cutting the samples with a precision cutting machine such as the QCUT 200 A prevents the sample from overheating or being mechanically deformed during the cutting process. Mounting with an epoxy resin mounting material and using an infiltration device helps to fill all pores before grinding/polishing. Using the correct consumables during grinding/polishing can prevent smearing and makes the pore percentage measurement more accurate. This month you can find out all these important points in our preparation of the month.

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Febbraio Compositi di alluminio fuso e ghisa grigia

La tendenza alla Progettazione leggera Multi-Materiale (Multi-Material Design - MMD) sta diventando sempre più significativa nel settore dei trasporti, in particolare nelle applicazioni automobilistiche. Questa tendenza è guidata dalle crescenti esigenze di sostenibilità, ottimizzazione dei costi e miglioramento delle prestazioni. La progettazione multimateriale prevede l'integrazione strategica di diversi materiali all'interno di un singolo componente per soddisfare specifici requisiti tecnici e consentire la produzione di componenti leggeri ed economicamente efficienti. Sfruttando le proprietà complementari di vari materiali, gli ingegneri possono ottimizzare l'integrità strutturale, il peso e il costo dei componenti dei veicoli, migliorando le prestazioni complessive e l'efficienza delle risorse
I compositi bimetallici Al/Fe, come esempio di una delle serie multi-materiale, offrono una combinazione favorevole di elevata forza e resistenza all'usura del Fe (acciaio/ghisa) e di elevata conducibilità termica, resistenza alla corrosione e leggerezza dell'Al (leghe di alluminio/alluminio puro). Questo mese sperimenterete la preparazione metallografica di questi componenti, dal taglio alla loro lucidatura finale.

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Marzo Examination of the solder balls in the ball grid array (BGA)

In a BGA (Ball Grid Array) printed circuit board, the solder balls are crucial for the electrical and mechanical connection between the BGA casing and the circuit board. The material of the solder balls is typically a lead-free alloy, as lead-containing solders are increasingly being avoided due to environmental and health regulations.

The most common lead-free alloy is SAC305. Such tin alloys offer a balance between melting point, mechanical strength and electrical conductivity. As an example, the melting point of SAC305 is around 217-221 °C, which is slightly higher compared to lead-containing solders.

The metallographic examination of a solder joint on a printed circuit board is a common examination as part of the quality assurance of printed circuit boards. This month's preparation shows you how this tin solder can be optimally prepared for microscopic examination.

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Aprile Thermally sprayed Al2O3 layer with open pores.

Al₂O₃-based thermal spray coatings are important components in various industrial applications, especially in areas where surfaces need to be protected from high temperatures and corrosive environments. Properties of Al₂O₃-based spray coatings include high temperature resistance, corrosion resistance and wear resistance. There are various methods of thermal spraying, including: Plasma spraying, flame spraying and high velocity oxygen fuel (HVOF) spraying. After the metallographic preparation of these coatings, the first question is always whether the coating is correctly prepared and the image under the light microscope/SEM should be as it is or whether the artifacts of the preparation are present in my microstructure. QATM's preparation methods according to DVS (German Society for welding and related procedures) data sheets guarantee the correct preparation of the spray protection coatings without preparation artifacts.

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Maggio Microstructure of a laser weld seam on top of the copper pin in an electro motor after etching with waterbased solution of ferrinitrate 10%.

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Giugno Hardness mapping on an edge-hardened gear wheel, tested with HV 1.

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Luglio Microstructure of a cast aluminium electrolytically etched with Barker etchant.

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Agosto Dendritic structure of a CoCrMo cast alloy after fine polishing.

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Settembre Micro laser weld seam on a copper sheet after fine polishing.

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Ottobre Microstructure of an edge-hardened gear with a ferrite-pearlite base structure, etched with 3% alcoholic nitric acid.

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Novembre Microstructure of an Al-Si alloy with primary silicon particles after fine polishing.

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Dicembre Microstructure of a nodular cast iron (GJS) after etching with nitric acid with and without using a lambda plate.

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